Barry Resistors, Terminations & Attenuators

Barry Application Notes:

BAN-CT-Solder 1.1 - Soldering Techniques When Soldering to CT (Matte Tin) Metallization Scheme

BAN-THR-1.1 --------Thermal Resistance of Flange Mounted Devices

BAN-THR-2.1 --------SMD Resistor Thermal Analysis

BAN-TCE-1.1 --------Copper versus Copper Tungsten Flanges

BAN-FEA-1.1 --------Finite Element Analysis Report - Advantages of the CTE Matched Flange

BAN-SMR-1.1 --------Investigation of Trim Notch and its Effect on Surface Mount Resistors in RF Circuit

BAN-PLT-1.1 --------NEW LTCC Electroless Nickel Gold Plating (c)

BAN-TST-1.1 -------- RF Measurement Techniques

BAN-Match-1.1 ----- Attenuator & Termination Matching for Ferrite Junction Isolators

BAN-ALN-1.1 ------- Comparison of RF Terminations with BEO and ALN Substrates

BAN-TRQ-1.1---------Flanged Device Mounting Recommendations

Modelithics Global Models™ Substrate Scalable Models
These measurement-based models, available for selected Barry components, are both substrate and part-value scalable. Each model includes complete documentation detailing the test fixtures used, measurement conditions, range of validity, and model-to-measurement data comparisons.