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RM Chip Configuration

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Flip Chip Resistor with Backpad

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RM 0805 CB - 50R0 JN -91

RM	= Flip Chip Resistor with Backpad
0805	= chip size .080" x.050"
CB	= metallization scheme, Tin Lead over Nickel over Silver * SEE BELOW FOR OTHER OPTIONS
-50R0	= required ohmic value (.1 Ohm to 1 Gigohms available)
JN	= tolerance and testing JN is 5% tolerance, standard inspection **SEE BELOW FOR OTHER OPTIONS
-91	= -91 represents .015" mil Alumina ***SEE BELOW FOR OTHER OPTIONS

* Metalization Schemes (Not All Options Available on All Packages)

	Termination Material/Finish	RoHS	BeO	Alumina or BeO Free	Solder	Epoxy	Wire- bond
BA	Palladium Silver	Yes	No	Yes	No	Yes	No
CB	Tin Lead over Nickel over Silver	No	Yes	Yes	Yes	No	No
CT	Matte Tin over Nickel over Silver	Yes	Yes	Yes	Yes	No	No
EA	Gold I/O with Palladium Silver Ground	Yes	No	Yes	Yes (GND)	Yes	Yes (I/O)
FA	Gold I/O with Platinum Gold Ground	Yes	No	Yes	Yes (GND)	Yes	Yes (I/O)
GA	Gold	Yes	No	Yes	No	Yes	Yes
HA	Gold over Platinum Gold I/O with Plat. Gold Ground	Yes	Yes	No	Yes (GND)	Yes	Yes (I/O)
JA	Gold over Platinum Gold	Yes	Yes	No	No	Yes	Yes
	I/O = Input / Output Pads

F	1%	-90	.010" Alumina (only RS,RM, AS, AM packages)
G	2%	-91	.015" Alumina
J	5%	-93	.025" Alumina
K	10%	-94	.040" Alumina
L	20%	-95	.010" BeO (only RS,RM, AS, AM packages)
X	Special	-96	.015" BeO
		-98	.025" BeO
		-99	.040" BeO
		-9F	.060" BeO
		-9X	Special, assigned by factory
		-83	.025" BeO Free
		-84	.040" BeO Free

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