Find the product you need now!

AV Chip Configuration

Scroll down for package options.

PI-Pad T-Pad

1/2 Wrap Around Attenuator Chip

Click here to immediately go to available data sheets for AV Series---->>>>>>>>>

AV C 2525 CB - 0100 JN -99

AV	= 1/2 Wrap Around
C	= represents part is castellated if chip is 1206 or larger (assigned by factory)
2525	= chip size .250" x.250"
CB	= metallization scheme, Tin Lead over Nickel over Silver * SEE BELOW FOR OTHER OPTIONS
-0100	= required dB value (.25 to 32 dB )
JN	= tolerance and testing JN is 5% tolerance, standard inspection **SEE BELOW FOR OTHER OPTIONS
-99	= -99 represents .040" mil BeO ***SEE BELOW FOR OTHER OPTIONS

* Metalization Schemes (Not All Options Available on All Packages)

	Termination Material/Finish	RoHS	BeO	Alumina or BeO Free	Solder	Epoxy	Wire- bond
BA	Palladium Silver	Yes	No	Yes	No	Yes	No
CB	Tin Lead over Nickel over Silver	No	Yes	Yes	Yes	No	No
CT	Matte Tin over Nickel over Silver	Yes	Yes	Yes	Yes	No	No
EA	Gold I/O with Palladium Silver Ground	Yes	No	Yes	Yes (GND)	Yes	Yes (I/O)
FA	Gold I/O with Platinum Gold Ground	Yes	No	Yes	Yes (GND)	Yes	Yes (I/O)
GA	Gold	Yes	No	Yes	No	Yes	Yes
HA	Gold over Platinum Gold I/O with Plat. Gold Ground	Yes	Yes	No	Yes (GND)	Yes	Yes (I/O)
JA	Gold over Platinum Gold	Yes	Yes	No	No	Yes	Yes
	I/O = Input / Output Pads

F	1%	-90	.010" Alumina (only RS,RM, AS, AM packages)
G	2%	-91	.015" Alumina
J	5%	-93	.025" Alumina
K	10%	-94	.040" Alumina
L	20%	-95	.010" BeO (only RS,RM, AS, AM packages)
X	Special	-96	.015" BeO
		-98	.025" BeO
		-99	.040" BeO
		-9F	.060" BeO
		-9X	Special, assigned by factory
		-83	.025" BeO Free
		-84	.040" BeO Free

Click here to immediately go to available data sheets for AV Series---->>>>>>>>>

Web Site Hosted by VantelWeb.com. If you have a problem with this site, notify kevin@vantelweb.com