LTCC Design Guidelines LTCC TR Module Barry Catalog

Download Now

2010 Catalog
2010 Barry Catalog

 

LTCC Design Guidelines
LTCC Design Guidelines

B&W Version

 

LTCC TR Module
LTCC T/R Module

 

ISO Certificate
ISO Certificate
 

 

AS Chip Attenuator -
Flip Chip (no metal on backpad)

(ALN is not recommended for Military Applications, please consider BeO,
or BeO Free (a High Density Alumina)  for these requirements.)

Quote Form Quote Form Engineering Question

Click on link for REPRESENTATIVE data sheet,
or click on link to request data sheet based on your requirements.
AS Pi Chip                  AS T Chip
PI Pad                                                T-Pad
Size  
0706
Alumina Data Sheet
0904
1005
Under Construction - contact Barry for more info
1612
Under Construction - contact Barry for more info

 

PI-Pad only available in size 0904.
T-Pad only available in sizes 0405, 0706, 1005, 1612.

For More Ordering Options.............Config
Config

 
   
     
What's New  |   Reps  |  Sales  |  Support
  About Barry  |  Quick Quote  |  Jobs  |  Contact Us 

LTCC   | Semiconductor Enclosures  | Plating   |  Machining  |   Assembly Partners

Web Site Hosted by VantelWeb.com. If you have a problem with this site, notify kevin@websearchspecialists.com