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T-Pad ..................................PI-Pad
Flip Chip Attenuator with Back Metallization
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AM 0706 CB - 0100 JN -91
| AM | = Flip Chip with Back Metallization |
|---|---|
| 0706 | = chip size .070" x.060" |
| CB | = metallization scheme, Tin Lead over Nickel over Silver * SEE BELOW FOR OTHER OPTIONS |
| -0100 | = required dB value (.25 to 32 dB ) |
| JN | = tolerance and testing JN is 5% tolerance, standard inspection **SEE BELOW FOR OTHER OPTIONS |
| -91 | = -91 represents .015" mil Alumina ***SEE BELOW FOR OTHER OPTIONS |
* Metalization Schemes (Not All Options Available on All Packages)
Termination Material/Finish |
RoHS |
BeO |
Alumina or BeO Free |
Solder |
Epoxy |
Wire- bond |
|
|---|---|---|---|---|---|---|---|
| BA | Palladium Silver | Yes |
No |
Yes |
No |
Yes |
No |
| CB | Tin Lead over Nickel over Silver | No |
Yes |
Yes |
Yes |
No |
No |
| CT | Matte Tin over Nickel over Silver | Yes |
Yes |
Yes |
Yes |
No |
No |
| EA | Gold I/O with Palladium Silver Ground | Yes |
No |
Yes |
Yes (GND) |
Yes |
Yes (I/O) |
| FA | Gold I/O with Platinum Gold Ground | Yes |
No |
Yes |
Yes (GND) |
Yes |
Yes (I/O) |
| GA | Gold | Yes |
No |
Yes |
No |
Yes |
Yes |
| HA | Gold over Platinum Gold I/O with Plat. Gold Ground | Yes |
Yes |
No |
Yes (GND) |
Yes |
Yes (I/O) |
| JA | Gold over Platinum Gold | Yes |
Yes |
No |
No |
Yes |
Yes |
| I/O = Input / Output Pads |
**Tolerances ***Substrate Options
Not All Options Available on All Packages
F |
1% |
-90 |
.010" Alumina (only RS,RM, AS, AM packages)
|
|
|---|---|---|---|---|
G |
2% |
-91 |
.015" Alumina
|
|
J |
5% |
-93 |
.025" Alumina
|
|
K |
10% |
-94 |
.040" Alumina
|
|
L |
20% |
-95 |
.010" BeO (only RS,RM, AS, AM packages)
|
|
X |
Special |
-96 |
.015" BeO
|
|
-98 |
.025" BeO |
|||
-99 |
.040" BeO |
|||
-9F |
.060" BeO |
|||
-9X |
Special, assigned by factory |
|||
-83 |
.025" BeO Free |
|||
-84 |
.040" BeO Free |
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