LTCC Design Guidelines LTCC TR Module Barry Catalog

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2010 Catalog
2010 Barry Catalog

 

LTCC Design Guidelines
LTCC Design Guidelines

B&W Version

 

LTCC TR Module
LTCC T/R Module

 

ISO Certificate
ISO Certificate
 


AM Chip Attenuator - Flip Chip with Back Metallization

(ALN is not recommended for Military Applications, please consider BeO,
or BeO Free (a High Density Alumina)  for these requirements.)

 

Quote Form Quote Form Engineering Question

 

AMtChip
T-Pad

AMpiChip
PI-Pad
Size
0706
0904
1005
1612
 
 
   
     

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